Model: ZM-R7220A
Repair Component Type: Supports BGA, QFP, QFN, CSP, SOP, and more.
Component Size: Ranges from 2×2 mm to 60×60 mm.
Temperature Precision: ± 3°C
Machine Movement: Automated component removal and mounting.
CCD Optical Alignment System: Placement precision of ± 0.02 mm.
Laser Positioning Function: Facilitates fast and accurate positioning of components and PCBs.
Mounting Pressure Control: Highly sensitive to protect PCB from damage.
Repair Success Rate: Over 99%
Power Supply: AC 220V±10％, 50/60 Hz
Total Power Consumption: Maximum of 5100W
Heater Power: Top heater: 1000W
Bottom heater: 1200W
IR heater: 2700W
Control System: Intelligent programmable controller
Temperature Control: K-type thermocouple (closed loop).
Independent temperature control with accuracy within ± 3°C
Positioning: Laser positioning and V-groove, PCB support.
PCB Size: Maximum: 415×370 mm
Minimum: 6×6 mm
BGA Chip Size: Maximum: 60×60 mm
Minimum: 2×2 mm
Dimensions: Length: 685 mm
Width: 635 mm
Height: 960 mm
Sensors: 1 unit
Model No: ZM-R5860
Power Supply: AC 220V±10%, 50/60 Hz
Power Consumption: Maximum 5.0 KW
Top heater: 0.8 KW
Bottom heater: 1.2 KW
IR preheater: 2.7 KW
Other components: 0.3 KW
PCB Size: Maximum: 410×370 mm
Minimum: 10×10 mm
BGA Chip Size: Maximum: 40×40 mm
Minimum: 10×10 mm
IR Heater Size: 375×285 mm
Temperature Sensor: 1 unit
Operation Method: 7″ HD touch screen
Control System: Autonomous heating control system with V1 software copyright.
Alignment System: Laser dot alignment
Vacuum Adsorption: Manual operation
Temperature Control: K-type thermocouple closed-loop control with accuracy up to ±3°C.
Positioning: V-groove with universal fixture.
Dimensions:
Length: 635 mm
Width: 620 mm
Height: 655 mm
Weight: 43.5 kg
Model No: WDS 620
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