Optical BGA Rework Machine
The Optical BGA Rework Machine ZM R 7220A is a high-performance BGA rework station designed for precise and efficient repair of PCBs and BGA chips. Built with advanced technology, it features a powerful heating system with top, bottom, and infrared heaters, ensuring even and controlled heat distribution for complex rework tasks. With an intelligent programmable controller and computer connectivity, this machine offers excellent flexibility and control for users.
Device Model: ZM-R7220A
Power Supply: AC 220V ± 10%, 50/60Hz
Total Power: Maximum 5300W
Heater Power:
- Top Heater: 1200W
- Bottom Heater: 1200W
- IR Heater: 2700W
Electrical Materials: Features an intelligent programmable controller with the ability to connect to a computer for enhanced control and customization.
Temperature Control: Uses a K-type thermocouple in a closed-loop system for independent temperature control, offering high precision with an accuracy within ±1°C.
Positioning System: V-groove with PCB support for stable and accurate positioning during repairs.
Dimensions: 680mm (Length) x 640mm (Width) x 960mm (Height)
PCB Size:
- Maximum: 415 x 370mm
- Minimum: 6 x 6mm
BGA Chip Size:
- Maximum: 60 x 60mm
- Minimum: 0.6 x 0.6mm
Color: White
Weight: 79kg
Key features of the ZM R7220A include:
- High-resolution touch screen for easy operation
- Automatic placement and desoldering capabilities
- Real-time temperature monitoring with over-temperature protection
- Precision optical alignment for accurate rework
- Carbon fiber infrared heater for efficient heating and cooling
The Optical BGA Rework Machine ZM R7220A is an advanced tool designed for high-precision repair of BGA (Ball Grid Array) components. This machine is equipped with an innovative optical alignment system, ensuring precise placement and rework for even the smallest components, including those as small as 2mm². With its robust features, including real-time temperature monitoring, carbon fiber infrared pre-heating, and an industrial-grade CCD camera, the ZM R7220A offers reliable performance in PCB repairs. For more detailed information, visit the manufacturer’s site or a distributor offering the ZM R7220A BGA rework machine.
This Optical BGA Rework Machine WDS 620 features an independent 3-zone temperature control system with top and bottom hot air heating and infrared preheating for fast and even heat distribution. The infrared gold-plated light tubes ensure precise heating, with ±1°C accuracy, and the upper and lower zones can operate independently or together. A high-precision K-type thermocouple and PID self-setting system offer real-time temperature monitoring and curve analysis on a touch screen. Know more about us
The optical alignment system uses a high-definition CCD camera with auto-focus, color correction, and brightness adjustment, displayed on a 15-inch HD monitor.
Designed with user convenience in mind, the machine has a touch interface, 360-degree rotating BGA nozzles, and micrometer-level fine-tuning for precise X, Y, and R-axis adjustments.
Device Model: WDS-620
Total Power: 5300W
Top Heater: 1200W (for logic board)
Bottom Air Heater: 1200W + 2700W
Electrical Selection: Equipped with a driving motor, smart temperature controller, and color touch screen.
Voltage: 110V/220V
Applicable Chip Sizes:
- Maximum: 80 x 80mm
- Minimum: 1 x 1mm
Temperature Control: High-precision K-type sensor (Closed Loop), with independent temperature control.
Weight: 75kg
PCB Board Size:
- Maximum: 400 x 390mm
- Minimum: 10 x 10mm
Dimensions: 1650mm (Length) x 630mm (Width) x 850mm (Height
Key features include:
- Independent 3-zone temperature control for precise heat management.
- Infrared gold-plated light tubes for optimal preheating.
- Touch screen interface for easy temperature and operation adjustments.
- Micrometer-level fine-tuning of the X, Y, and R-axes, ensuring precise positioning for BGA component rework.
- Maximum BGA chip size: 80 x 80mm, with the ability to repair a wide range of PCB sizes.
This machine is ideal for professionals looking for an efficient and reliable solution for BGA soldering and desoldering, providing both flexibility and precision for high-performance applications