ZM-R 7220a Optical Automatic BGA Rework Station
Device Model: ZM-R7220A
Device Description: LCD Screen repair machine, COF/TAB bonding equipment etc.
Repair Component Type: BGA/QFP/QFN/CSP/SOP,etc
Automation Grade: Automatic
Power Consumption: Max 5100W
Dimensions: L685xW635xH960 mm
Warranty: 1 year
PCB Size: 415×370 mm
Get the best deal!
Kindly Submit the form. Our team will contact you soon.
Product Description:
- Component size: 2*2mm ~ 60*60 mm
- Temperature Precision: ± 3℃
- Machine Movement: Automatically Remove / Mount Component
- CCD Optical Alignment System Placing Precision: ± 0.02MM
- Laser Positioning Function for fast positioning component and PCB
- .Highly Sensitive Mounting Pressure Control to protect PCB from damage.
- Repair Success Rate: 99%
- Power: AC 220V±10％ 50/60 Hz
- Total Power: Max 5100W
- Heater Power: Top heater 1000W Bottom heater 1200W IR heater 2700 W
- Electrical materials: Intelligence Programmable Controller
- Temperature control: K-type thermocouple (Closed Loop), independence temperature control, accuracy within ± 3 ℃
- Positioning: Laser Positioning and V-groove, PCB support
- PCB size: Max 415×370 mm Min 6×6 mm
- BGA chip: Max 60×60mm Min 2×2 mm
- Dimensions：L685×W635×H960 mm
WDS-620 Optical Automatic BGA Rework Station
Device Model: WDS-620
Technology parameter of wds-620 automatic bga rework station:
- Power supply: AC 220V±10% 50/60Hz
- Dimension: L650×W630×H850mm
- PCB size: Max 450×390mm Min 10×10 mm
- BGA Chip Sixe: 80*80mm(max); 1*1mm(Min)
- IR Heater Size: 285*375mm
- Operation Method: 7″ HD Touch Screen
- Control System: Autonomous heating control system V2
- Alignment System: 2 Million Pixel SD digital imaging system, automatic optical zoom with laser red-dot indicator
- Temperature Control: (High precision K-sensor) (Closes loop), independent temp, controller, theprecision can reach ±1deg C
- Positioning: V-groove with universal fixture
Non Optical BGA Rework Station
ZM-R5860 Non Optical Automatic BGA Rework Station
Device Model: ZM-R5860
Functions of ZM-R5860 Smart BGA Rework Equipment
1.Temperature Curve Setting: High-definition touch screen operation, real-time display and, editing of temperature curves, each group of temperature curves can be set to 8 segments, 100 groups of temperature curves can be stored, with temperature self-organizing function.
2. Laser Red-dot Positioning Guide: Laser indicator for PCB and component positioning.
3. Vacuum Adsorption: The external vacuum suction pen is convenient for taking BGA.
Specification:
- Power Supply: AC220V±10% 50/60HZ
- PCB Size: 410*370mm(Max); 10*10mm(Min)
- BGA Chip Size: 40*40mm(Max); 10*10mm(Min)
- IR Heater Size: 375*285mm
- Alignment System: Laser dot
- Positioning: V-groove with universal fixture
- Dimensions: L635*W620*H655mm
- Weight: 43.5KG
ZM-R5830 Non Optical Automatic BGA Rework Station
Device Model: ZM-R5830
Functions of ZM-R5830 Smart BGA Rework Equipment
1.Temperature Curve Setting: High-definition touch screen operation, real-time display and, editing of temperature curves, each group of temperature curves can be set to 8 segments, 100 groups of temperature curves can be stored, with temperature self-organizing function.
2. Laser Red-dot Positioning Guide: Laser indicator for PCB and component positioning.
3. Vacuum Adsorption: The external vacuum suction pen is convenient for taking BGA.
Specification:
- Power Supply: AC220V±10% 50/60HZ
- Alignment System: Laser dot
- Positioning: V-groove with universal fixture
- Dimensions: L535*W650*H600mm